Nick Tang
Packaging Engineer
Taoyuan
Summary
Packaging Engineer. Develop validation plans, drawings, and BOMs based on customer requirements, and review test results to improve packaging solutions. Provide packaging material solutions such as wooden crates, corrugated cardboard, and foam, balancing protection, packaging space utilization, and transportation efficiency.
Overview
2
2
Languages
12
12
years of professional experience
Work History
Senior Packaging Design Engineer
Inventec Corporation
08.2017 - 02.2026
- Support the project from RFQ quotation through mass production.
- Translate customer requirements into packaging designs, drawings, BOMs, and validation plans for server and PCBA products.
- Provide cushioning, corrugated, foam, and PE tray solutions for AWS L11, Dell L6/L10, AMD, ZT system, Lenovo, Microchip and other L10 server platforms.
- Review test results, analyze failure causes, and collaborate with customers and cross-functional teams to develop packaging improvement solutions.
- Maintain 2D/3D packaging drawings and BOM in AutoCAD and Creo for product design changes.
- Optimize material usage, packaging utilization, and transportation efficiency to reduce packaging costs for each product.
Packaging Design Engineer
Chang Hong Polystyrene Co., Ltd.
08.2014 - 10.2016
- Designed cushioning packaging for display and electronic products, including CAD drawings and 3D models.
- Worked with packaging materials, suppliers, and manufacturing processes to support packaging development.
- Complete packaging validation to confirm cushioning performance for display and electronic products.
Education
Bachelor of Science - Digital Content and Technology
National Taichung University of Education
Taiwan01-2012
Skills
- L11 Rack/L6/L10 server/PCBA
- Packaging design and validation
- Root cause analysis & packaging improvement
- Cost optimization
- AutoCAD 2D
- Creo 3D
- Packaging BOM
- ISTA testing
- RFQ NRE quotation
- Packaging project management
- Customer program support
- Cross-functional coordination
Timeline
Senior Packaging Design Engineer
Inventec Corporation
08.2017 - 02.2026
Packaging Design Engineer
Chang Hong Polystyrene Co., Ltd.
08.2014 - 10.2016
Bachelor of Science - Digital Content and Technology
National Taichung University of Education
Project experience
- AWS | L11 Rack – Goshin Bonsai project | Rack-level | NPI packaging design & validation
- Dell | L6 System and L10 system(1U & 4U) | Server | NPI packaging design & validation
- AMD / Lenovo / ZT Systems / Microchip | Server | NPI packaging design & validation
- AUO / Acer / Delta | Display panel | Packaging design & validation