YeJun Han

Hello! I am a Etching R&D Process Senior Engineer currently working at Winbond. On 03/07/21, I joined TSMC as a FEOL Etching Process Engineer. As my first job, I have been working here for a year and a half. During this time, I have actively participated in various process improvement projects, focusing on increasing production capacity and reducing costs. These initiatives have yielded favorable outcomes, allowing me to gain a deeper understanding of process engineering. Subsequently, on 07/18/22, I transitioned to my current position as an Etching Process R&D Engineer at Winbond. Here, my primary responsibilities involve independent research and development of etching processes. I face the challenges associated with shrinking DRAM designs and strive to resolve them one by one. This role has provided me with the opportunity to delve into research and apply my expertise, further enhancing my skills and abilities. In addition to my work experience, I possess the following skills: - Etching Process: I have extensive experience and knowledge in FEOL and BEOL etching processes, enabling me to execute and optimize related procedures. - Problem Solving: I excel at analyzing and resolving process-related issues, offering effective solutions. - Team Collaboration: I am skilled in teamwork and effective communication with colleagues and cross-functional teams to achieve common goals. - Technical Research: I have a strong aptitude for technical research, continuously learning and exploring new process technologies and applying them in practice. I hope this self-introduction provides you with a better understanding of my work experience and skills. If you have any questions or require further information, please feel free to let me know. Thank you

• Resolved product issue through consumer testing.
• Achieved huge improvement by introducing JMP for yield loss failure mode and effects analysis tasks.
• Achieved affort Coventor provider of 3-D modeling and simulation through effectively helping with prevention in advance.
• Collaborated with R&D team of Winbond in the development of 1Y tech project in Depart of ETCH .

• Volunteering, community service
• Cooking
• hiking