Background
My name is Lin Yan-Hong, born into an ordinary family. My father was a taxi driver and passed away in 2021, while my mother, formerly a cleaner, is now retired. My eldest brother works in the semiconductor industry, and my second brother runs a media business. Since childhood, my parents instilled in me the values of diligence and perseverance, teaching me to complete tasks promptly and work steadily towards my goals. These lessons have remained deeply ingrained in me.
Personality & MBTI
My MBTI type is INTP.
Strengths:Proficient in anomaly analysis
Highly creative and adaptable
Thinks flexibly and can approach problems from unconventional perspectives
Challenges:Tends to be overly rational, focusing on logical analysis while potentially overlooking interpersonal relationships and emotional factors
May struggle with execution, sometimes getting lost in thought and delaying action, which could affect project timelines
Prefers independent work, with room for improvement in teamwork and communication skills
Work Experience
Nanya Technology – Lithography Process Department (7 years) During my initial four years at Nanya Technology, I worked as an Assistant Engineer in the Lithography Process Department, where I was responsible for inline product judgment, workflow optimization, and interdepartmental communication with the CIM team. I assisted in software development to enhance operational efficiency. Later, I transitioned to another department, specializing in I-line & Coater equipment operations and conducting layer abnormality analysis, including:Implant layer (FEOL~BEOL), TSV layer, TECN & SWR issues
Online issue handling as a Sponsor
Track-related expertise:
AreMA case abnormal analysis (by4 clean hot plate & temperature curve anomalies)
MLR & CHR layer re-run/re-bake wafer processing
Troubleshooting wafer double coating issues
Identifying frequent wafer drop or chip-out caused by fork problems
Track recipe setup
Scanner-related expertise:
Scanner operations including FEM exposure
UMM and FD (PSFM) Shift analysis
UMM issue traced back to light source problems
FD issue caused by measurement equipment errors
FIWA Reject issues in BEOL layers, often due to mark damage
Additionally, I collaborated with R&D and integration departments to define experimental conditions, set up track recipes and scanner alignment marks, and provided feedback and tracking to ensure process stability.
Career Aspiration
I hope to further expand my expertise in semiconductor manufacturing and look forward to the opportunity to contribute my skills to your esteemed company.
成長背景:我是林彥宏,出生於平凡家庭。父親是一名計程車司機,於2021年去世;母親曾是一名清潔工,現已退休。大哥在半導體行業工作,二哥則經營自媒體。從小父母親身教言傳,教導我們今日事今日畢,做事不要好高鶩遠,要一步一腳印。這些教誨我至今牢記在心。
性格優缺點與MBTI:
我的MBTI為INTP
優勢:善於分析異常,創造力高,思維靈活,能夠跳脫框架
挑戰:可能過於理性:在決策時偏向邏輯分析,可能忽略人際關係與情感因素。
執行力較弱:容易陷入思考而延遲行動,可能影響專案進度。
社交能力較低:偏好獨立工作,可能需要提升團隊合作與溝通能力
工作經驗:
在南亞科黃光製程部門工作將近七年,進入南亞科初期的前四年,我在黃光製程部門擔任副工師,主要工作是Judge inline product、改善副工作業流程,並與其他部門(CIM)溝通,統整inline issue與分析,協助開發軟體以減少工作負擔。之後調到其他部門,主要負責I-line & Coater機台,進行Layer異常分析(implant layer[FEOL~BEOL]、TSV layer、TECN & SWR),擔任Sponsor時處理線上異常,Track部分會的技能如AreMA Case 異常分析(by4 clean hot plate 以及升溫曲線異常), MLR&CHR layer補run補烤wafer, 與Wafer發生Double Coating時該如何處理, Wafer發生頻繁掉片與缺角確認為fork問題, Set up track recipe, Scanner會的技能部分如曝FEM,以及處理過UMM和FD(PSFM)Shift,UMM問題後續確認為光源問題,FD問題為量測機台導致,BEOL Layer好發FIWA Reject問題則是mark damage導致。實驗部分負責與RD和整合部門及主管溝通,確認過貨條件,設置Track recipe和Scanner alignment mark,並記錄和確認過貨條件,進行反饋和追踪。
未來期許:希望能學習更多與半導體製程相關的知識,也希望貴公司能給予我面試機會。
Root-cause analysis
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