

A versatile and goal-driven Electronics Engineer with a proven track record of delivering exceptional results in the manufacturing sector. Well-experienced in semiconductor, PCB Assembly back-end operations and fast-paced manufacturing environments. A Strategic thinker emphasizing in assembly process design and process optimization.
Time management and on-time delivery
Flexible at any areas of the job
Career-focused individual
Collaborative individual that is eager to attain continuous learning
Process Optimization
Quality Management
Product Manufacturing
Lean Six Sigma Literacy
Technical Presentations and Reporting
Product Engineering Drawing Analysis
Super NeoCu UTC5000 and UTC1000 Shinkawa Wire bond Machine
ASM Eagle 60 Wire bond Machine
K&S Connx Wire bond Machine
ASM AD830/839 Die bond Machine
BESTEM D01 Die bond Machine
PTR 1000 Bond Tester ( Pull Test and Ball/Die Shear)
Measuring Microscope
Minitab
CAM350 and ODB Viewer 2305
C and C Language (Basic Knowledge)
Microsoft Office (Excel, PowerPoint, Word, Outlook)