Summary
Overview
Work History
Education
Skills
Websites
Personal Information
Trainings And Workshops Attended
Awards
References
Timeline
Generic
ANGEL ONG

ANGEL ONG

Electronics Engineer
Hsinchu City,Xiangshan District

Summary

A versatile and goal-driven Electronics Engineer with a proven track record of delivering exceptional results in the manufacturing sector. Well-experienced in semiconductor, PCB Assembly back-end operations and fast-paced manufacturing environments. A Strategic thinker emphasizing in assembly process design and process optimization.

Overview

5
5
years of professional experience
1
1
Language

Work History

Product Manufacturing Engineer

TOP UNION ELECTRONICS Corp.
3 2023 - Current
  • Lead comprehensive review process for new products, employing DFM, NPI, and PFMEA principles to ensure manufacturability, compliance with industry standards and efficiency in PCB assembly
  • Conceptualize and design streamlined processes for new product introductions and high-volume manufacturing, resulting in 95% on-time delivery rate and consistently high-quality outputs
  • Provide valuable suggestions to customers for product design enhancements, resulting in significant process efficiency improvements and over 85% optimization of PCB panel usage
  • Drive and maintain culture of continuous improvement, reducing non-processing time, cost savings and reduction of 35% in customer complaints
  • Deliver prompt support to customers, serving as primary point of contact for addressing their concerns and demands in timely manner
  • Conduct root cause analysis and failure investigations to identify and resolve quality and non-conformance issues
  • Design PCB stencils and production tools, collaborating closely with suppliers to ensure timely production and adherence to quality standards.

Process Quality Engineer

MINEBEAMITSUMI
08.2019 - 12.2022
  • Implemented continuous process improvement initiatives for high-volume IC manufacturing, utilizing statistical process controls and systematic problem-solving methodologies such as DOE, DMAIC, and RCA, resulting in 92% reduction in cost and 91% increase in productivity and capacity in Diebond and Wirebond Process
  • Conducted comprehensive risk assessments using PFMEA approach to identify and mitigate internal risks to manufacturing process
  • Optimized and fine-tuned process programs, machine recipes and parameters for wirebond and diebond operations, ensuring optimal performance and efficiency
  • Led qualification process for new products in wirebonding process, ensuring strict adherence to customer specifications and passing reliability standards
  • Developed and implemented quality plans, and control procedures to ensure that product consistently met or exceeded customer specifications and expectations.

Associate Software Engineer

ACCENTURE Inc.
01.2019 - 08.2019
  • Provided white-glove support by diagnosing and troubleshooting technical issues encountered by Microsoft clients including on-premise infrastructure to M365 migration, on-premise network and server configuration, and M365 integration with active directory
  • Conducted research on complex technical issues, and leveraged collaboration support tools and processes to expedite resolution to clients.

Education

Bachelor of Science in Electronics Engineering -

University of Negros Occidental-Recoletos
Bacolod City, Negros Occidental

Skills

Time management and on-time delivery

Flexible at any areas of the job

Career-focused individual

Collaborative individual that is eager to attain continuous learning

Process Optimization

Quality Management

Product Manufacturing

Lean Six Sigma Literacy

Technical Presentations and Reporting

Product Engineering Drawing Analysis

Super NeoCu UTC5000 and UTC1000 Shinkawa Wire bond Machine

ASM Eagle 60 Wire bond Machine

K&S Connx Wire bond Machine

ASM AD830/839 Die bond Machine

BESTEM D01 Die bond Machine

PTR 1000 Bond Tester ( Pull Test and Ball/Die Shear)

Measuring Microscope

Minitab

CAM350 and ODB Viewer 2305

C and C Language (Basic Knowledge)

Microsoft Office (Excel, PowerPoint, Word, Outlook)

Personal Information

  • Age: 27
  • Height: 5'3"
  • Weight: 45 kg
  • Date of Birth: 11/12/96
  • Gender: Female
  • Nationality: Filipino
  • Marital Status: Single
  • Religion: Roman Catholic

Trainings And Workshops Attended

  • GRR and Measurement System Analysis Training - September 2019
  • Statistical Process Control Training - October 2019
  • Problem Solving Framework and Root Cause Analysis Training - October 2019
  • Design of Experiment (DOE) Training - July 2021
  • Failure Mode and Effect Analysis FMEA (following AIAG) Training - June 2022

Awards

  • IECEP-Outstanding Student Academic Awardee - April 2018
  • University-Wide Research Exposition Silver Awardee - April 2018
  • Best Kaizen Gold Awardee - September 2020
  • Quality Control Circle-Kaikaku Qualifier - December 2020

References

  • Elvie Banasig, Schlumberger-EUR RP Workforce Coordinator, +96597282043, ebanasig@slb.com
  • Anggun Nurfitriani Handoko, MBA, Top Union- Product Manufacturing Engineer, +886973924128, anggunnurfitriani@gmail.com
  • Engr. John Kimwell Laluma, University of Negros Occidental- Recoletos, Professor, +639985777012, john.kimwell.laluma@gmail.com

Timeline

Process Quality Engineer

MINEBEAMITSUMI
08.2019 - 12.2022

Associate Software Engineer

ACCENTURE Inc.
01.2019 - 08.2019

Product Manufacturing Engineer

TOP UNION ELECTRONICS Corp.
3 2023 - Current

Bachelor of Science in Electronics Engineering -

University of Negros Occidental-Recoletos
ANGEL ONGElectronics Engineer