Che-Chen Hsu

Responsibilities:

• Conducted failure analysis for units facing process or reliability test failures, collaborating closely with cross-functional teams to identify root causes. Implemented mitigation plans and corrective actions accordingly.
• Collaborated with multiple vendors to explore and identify potential materials for components of cutting-edge AR devices with rigorous requirements, fostering innovation and quality improvement initiatives.
• Partnered with mechanical engineers to develop in-house testing methodologies for material validation, simulating performance in real products.
• Collaborated with vendors to define flowcharts and specifications, ensuring thorough monitoring of materials qualities by OQC, IQC, and IPQC processes.
• Proactively explored emerging technologies to address potential future challenges, staying ahead of industry trends and ensuring continuous improvement.

Achievement:

• Led over 5 FA investigations into optical performance degradation post-reliability testing, navigating complex causes to identify interface issues as the root cause. Explored and validated new materials as correction activity, resulting in a remarkable reduction of failure rates from over 50% to 0% after aging.
• Established 3 robust FA flowcharts, all of which have been implemented as SOP for addressing similar types of failures.
• Collaborated with over 10 vendors to explore and validate new materials, executing a comprehensive testing plan for a new design change within a swift 3-month timeframe, subsequently adopted as the new POR in the following phase.
• Designed and executed DOE, resulting in optimal performance and robustness. The adopted process conditions became the new POR, showcasing over 100% improvement in mechanical strength during the ongoing phase with no reported issues in the early build.
• Explored 2 emerging technologies to address potential issues in new product designs, one of which offers potential solutions to upcoming challenges and is now under evaluation.
• Defined flowcharts and specifications for incoming materials qualification, resulting in a material-related issue-free build process.

Responsibilities:

• Delivered OCD solutions to monitor the process of next-generation technologies.
• Conducted field testing of algorithms developed by the R&D department, providing valuable feedback for refinement based on real-world applications.
• Cultivated and nurtured strong customer relationships with TSMC, gathering valuable insights and crafting strategic approaches to meet evolving needs and surpass expectations.

Achievement:

• Assigned to perform cross-functional tasks in OCD and XPS, demonstrating a rapid learning curve beyond the original role as an OCD application specialist.
• Through effective customer negotiation and task prioritization, consistently delivered all solutions aligned with customer requirements on time, without any schedule delays.

Responsibilities:

• Developed innovative processes to secure future market dominance.
• Collaborated closely with industry giants like Intel and Micron to optimize existing processes, delivering comprehensive technical reports to track progress.
• Implemented cutting-edge improvements by retrofitting tools with CIP parts, resulting in enhanced process efficiency and productivity.

Achievement:

• Implemented DoE methodology coupled with JMP prediction techniques to reduce raw process time by 50% without sacrificing film properties.
• Developed plasma with equivalent reactivity but achieved a remarkable 75% reduction in power consumption, effectively mitigating ion bombardment and revolutionizing process efficiency while maintaining superior quality standards.
• Demonstrated capability in developing patentable technology with two patents accepted and filed.