Cheng-I Lin
Staff Engineer
Taichung,TXG
Work Preference
Summary
Staff Engineer & Project Management Expert | 10+ Years in Semiconductor R&D & Advanced Packaging
Dedicated and results-driven semiconductor professional with over a decade of experience in R&D, advanced packaging (HBM, 3DIC, Fan-Out), and strategic project management. Proven track record of successfully driving New Product Introduction (NPI) into mass production while managing factory KPIs and mitigating risks. Recognized for excellent cross-departmental coordination and leadership, including organizing large-scale corporate events and workshop to foster innovation. Passionate about leveraging technical expertise and agile project management to achieve strategic business goals in dynamic, global environments.
Overview
10
10
years of professional experience
2
2
Languages
Work History
Staff Engineer - Strategical Program Management
MICRON MEMORY TAIWAN CO. LTD
09.2020 - Current
- Lead strategic program management, focusing on site KPI consolidation and Key Initiative Program (KIP) execution to drive factory efficiency.
- Site automated dashboard development to enhance productivity and reduce the loading of manual work.
- Coordinate internal and external communications to align strategic projects across global and local teams.
- Define project priorities, establish critical milestones, and execute comprehensive risk and issue control strategies.
- Organize and lead site-wide technical event and workshop, promoting cross-functional collaboration and engineering innovation
Sr. Engineer - R&D for FO PKG Development
SILICONWARE PRECISION INDUSTRIES CO. LTD
10.2016 - 09.2020
- Drove corporate R&D initiatives focusing on Fan-Out (FO) package development and process integration.
- Successfully integrated FO projects and developed NPIs, specifically for 3DIC, FOPOP, FOMCM, and FOSD technologies.
- Conducted advanced research and provided technical solutions for complex semiconductor packaging challenges.
Bumping process engineer – Ball mount/ Plating/ Etching
AMKOR TECHNOLOGY, TAIWAN
10.2015 - 10.2016
- Managed and optimized the WFLCSP Bumping process, encompassing Ball Mount, Plating, and Etching operations.
- Executed process improvements to enhance yield and maintain semiconductor equipment.
Education
Master of Science - Electrical Engineering
National Chung-Hsing University
Taichung 04.2001 -
Skills
Project management : Strategic Planning, KPI Tracking, Cross-Site Coordination
Factory KPI consolidation and management
Factory internal / external communication and strategic project coordination
Semiconductor packaging (FO-WLP, 3DIC, Flip Chip, HBM)
NPI engineering & mass production transition
Process Development for bumping, assembly and test
Introduce NPI (new equipment and new product) to mass production
Project priority and milestone definition
Data analysis & risk control
Excellent organizational skills, able to effectively coordinate cross-departmental communication and cooperation to achieve common goals
Photolithography, thin film deposition and vapor deposition process
Electroplated copper process
Semiconductor Equipment maintenance
WFLCSP Bumping process – Ball mount/ Plating/ Etching
Tools: SEM, AFM, JMP
Accomplishments
- 100% auto alert enablement for site KPI dashboard tracking with 93% positive feedback of team members
- 2 Times culture champion in Micron Taiwan Backend
- 45 Times Recognition from cross-functional leaders
Timeline
Staff Engineer - Strategical Program Management
MICRON MEMORY TAIWAN CO. LTD
09.2020 - Current
Sr. Engineer - R&D for FO PKG Development
SILICONWARE PRECISION INDUSTRIES CO. LTD
10.2016 - 09.2020
Bumping process engineer – Ball mount/ Plating/ Etching
AMKOR TECHNOLOGY, TAIWAN
10.2015 - 10.2016
Master of Science - Electrical Engineering
National Chung-Hsing University
04.2001 -