Cheng-I Lin
Staff Engineer
Taichung,TXG
Work Preference
Summary
Staff Engineer & Project Management Expert | 10+ Years in Semiconductor R&D & Advanced Packaging
Dedicated and results-driven semiconductor professional with over a decade of experience in R&D, advanced packaging (HBM, 3DIC, Fan-Out), and strategic project management. Proven track record of successfully driving New Product Introduction (NPI) into mass production while managing factory KPIs and mitigating risks. Recognized for excellent cross-departmental coordination and leadership, including organizing large-scale corporate events and workshop to foster innovation. Passionate about leveraging technical expertise and agile project management to achieve strategic business goals in dynamic, global environments.
Overview
2
2
Languages
10
10
years of professional experience
Work History
Staff Engineer - Strategical Program Management
MICRON MEMORY TAIWAN CO. LTD
09.2020 - Current
- Lead strategic program management, focusing on site KPI consolidation and Key Initiative Program (KIP) execution to drive factory efficiency.
- Site automated dashboard development to enhance productivity and reduce the loading of manual work.
- Coordinate internal and external communications to align strategic projects across global and local teams.
- Define project priorities, establish critical milestones, and execute comprehensive risk and issue control strategies.
- Organize and lead site-wide technical event and workshop, promoting cross-functional collaboration and engineering innovation
Sr. Engineer - R&D for FO PKG Development
SILICONWARE PRECISION INDUSTRIES CO. LTD
10.2016 - 09.2020
- Drove corporate R&D initiatives focusing on Fan-Out (FO) package development and process integration.
- Successfully integrated FO projects and developed NPIs, specifically for 3DIC, FOPOP, FOMCM, and FOSD technologies.
- Conducted advanced research and provided technical solutions for complex semiconductor packaging challenges.
Bumping process engineer – Ball mount/ Plating/ Etching
AMKOR TECHNOLOGY, TAIWAN
10.2015 - 10.2016
- Managed and optimized the WFLCSP Bumping process, encompassing Ball Mount, Plating, and Etching operations.
- Executed process improvements to enhance yield and maintain semiconductor equipment.
Education
Master of Science - Electrical Engineering
National Chung-Hsing University
Taichung 04.2001 -
Skills
Project management : Strategic Planning, KPI Tracking, Cross-Site Coordination
Factory KPI consolidation and management
Factory internal / external communication and strategic project coordination
Semiconductor packaging (FO-WLP, 3DIC, Flip Chip, HBM)
NPI engineering & mass production transition
Process Development for bumping, assembly and test
Introduce NPI (new equipment and new product) to mass production
Project priority and milestone definition
Data analysis & risk control
Excellent organizational skills, able to effectively coordinate cross-departmental communication and cooperation to achieve common goals
Photolithography, thin film deposition and vapor deposition process
Electroplated copper process
Semiconductor Equipment maintenance
WFLCSP Bumping process – Ball mount/ Plating/ Etching
Tools: SEM, AFM, JMP
Accomplishments
- 100% auto alert enablement for site KPI dashboard tracking with 93% positive feedback of team members
- 2 Times culture champion in Micron Taiwan Backend
- 45 Times Recognition from cross-functional leaders
Timeline
Staff Engineer - Strategical Program Management
MICRON MEMORY TAIWAN CO. LTD
09.2020 - Current
Sr. Engineer - R&D for FO PKG Development
SILICONWARE PRECISION INDUSTRIES CO. LTD
10.2016 - 09.2020
Bumping process engineer – Ball mount/ Plating/ Etching
AMKOR TECHNOLOGY, TAIWAN
10.2015 - 10.2016
Master of Science - Electrical Engineering
National Chung-Hsing University
04.2001 -