Summary
Overview
Work History
Education
Skills
Publications
Certification
Timeline
Generic
CHENG-YEN TSAI

CHENG-YEN TSAI

Principle Product Engineer

Summary

Award-winning [ Outstanding Performance績優人員] Engineer focused on Product bug &Customer platform issue. Highly effective at working with teams of designers and builders to accomplish projects on-time.

Overview

7
7
years of professional experience
3
3
Certifications
3
3
Languages

Work History

Principle Engineer

WINBOND
7 2021 - Current
  • Resolved critical issues during system integration phases, ensuring seamless transitions between design iterations.

Ex: Vatics EVB-M5S / MSIZ97 MPOWER, Solve the problem in 10 work days.

Ex: MTK7988, Retention unstable half year project, find out root cause.

  • Established strong working relationships with Japanese designers through exceptional communication skills, fostering trust and collaboration.

Ex : JD co-work : Kestrel4(20nm DDR3) CPR, Muses(16nm DDR4) on-going

  • Improved team productivity by providing technical guidance and mentoring junior engineers.

Ex: Develop auto-DA system&SOP, reduce the 90% verify time.

Ex: Lead team to finish D20nm new product verification in 8 weeks.

  • DDR2/DDR3/DDR4 verification experience

Ex: Cadmus2/3 (512Mb, DDR2), Wega3/4 (2Gb,DDR3), Kestrel/2/4 (4Gb,DDR3)

  • Advantest Training instructor -T5833ES (Certification from Advantest)T5000 series ATL programming Elementary Training

Ex: Training the dept member T5833ES half year 80% member can use the T5833ES analysis failure fluently.

Engineer - Senior Engineer

WINBOND
10.2017 - 06.2021
  • KGD (Known Good Die), RMA support / Yield improvement

Ex: Redundancy issue due to ass'y rubber. (20% failure ratio -> 0%)

Ex : KGD FT, different stage correlation : 95%

Ex: KERF yield improve for DDR2/DDR3 (From 1500ppm->under 150ppm

Ex: WLBI development : Sub-Vt leakage (WLBIDCA, VBLH-VSS max)

  • DRAM PFA locate the failure point : Delayer, Layout,

Ex: 50up case in half year for 2 years.


Education

Master of Science - Physics-Semi Conductor

NTU
04.2015 - 2017.04

Skills

KGD/PKG Failure Analysis

Publications

MCRL laser  (First Author), 8.435

Certification

[ATL 5000 series] License

Timeline

[Capability Development] Supervisor Training

07-2024

[Outstanding personnel], [Winbond]

05-2024

[ATL 5000 series] License

12-2021

Engineer - Senior Engineer

WINBOND
10.2017 - 06.2021

Master of Science - Physics-Semi Conductor

NTU
04.2015 - 2017.04

Principle Engineer

WINBOND
7 2021 - Current
CHENG-YEN TSAIPrinciple Product Engineer