CHIEN-JUI WANG

1. Main Responsibilities: Use C/C++ to write programs for FT/CP machines (V50/S100) to test wafers and packages. Set up circuits, solder PCB boards, and validate CORR SAMPLES for mass production at testing factories. If issues arise during PCB board testing, use a multimeter and oscilloscope to diagnose and resolve problems.

2. Collaboration: Understand the characteristics of electronic circuits. Discuss testing procedures with RD, SA, PD, and QA based on IC specifications. Collaborate with other departments to identify and solve problems encountered during testing.

3. Production Issues and Troubleshooting: In case of production anomalies with ICs, observe the map and contact the testing site to pinpoint and test the issues. Perform return on Wafer FAIL DIE. Analyze results from CSV files and issue commands to the testing site for corrective actions.

4. Reflection: Facing different products requires familiarity with IC characteristics to fully understand the testing flow. This is the most challenging part. The core of the job is problem-solving and assisting RD in identifying potential issues during testing.