CHIEN-LIANG LIN

AI Server:

1. Support RFI, RFP, RFQ and provide design proposal

2. Logical circuit design, Layout check

3. Card BOM maintenance(Component standardization, optimize design and deep drive on cost reduction)

4. Overall project responsibility in all EE design related – from project kick off to end of M.P.

5. Tolerance analysis & Simulation and Issue solving

6. Early engagement with customer in concept stage.

Automotive System/Hardware Design:

1. HPC/IVI/Smart Cockpit- QUALCOMM/Infineon/Renesas/TI.

2. Early engagement with customer in concept stage(NRE/RFQ/RFI Process).

3. ISO26262 Product assessment

4. IATF16949-2022 internal Auditor license

5. System Architectural planning, Development and Product Specification Definitions.

6. Technical Proposal Preparation

Automotive System/Hardware Design

- HPC/IVI/Smart Cockpit

- Ｑualcomm/Infineon/Renesas/TI.

- Communicate with Customer.

- ISO26262 Product assessment

- IATF16949-2022 internal Auditor license

- NRE/RFQ/RFI Process

- System Architectural planning, Development and Product Specification Definitions.

- Technical Proposal Preparation

- Departmental budget Planning

Achievement

(1)Leads and is responsible for projects and ensures communication method and model is suitable to collaborate team members to drive projects on time.

(2) On behalf of the supply chain to provide a technical consultant to support a cross-function team or less experienced fellows to resolve issues

(3) Evaluate technical options and represent business requirements to the engineering organization through responses to the customer requirement documents and detailed functional specifications

Achievement:

(4)Co-work with Tier 1 to do Vehicle verification.(propose to TATA, Ceer, TMA, Mahindra, Carmax, BYD, GAC, CHERY...)

• Assisted in reviewing circuit designs for Tesla car computer.
• Supported circuit design reviews for Tesla body controller.
• Conducted BOM comparison and design checklist based on Tesla design package.
• Collaborated with PCB manufacturers on DFM discussions and provided suggestions.
• Aided factory in introducing manufacturing processes for Tesla car computer body controller.
• Reviewed SMT DFM board files and gerber files for ICT testing considerations.
• Analysed and verified production issues and reported findings.
• Led a team of over 15 individuals in Tesla product development.

• Smart phone:
• 1. ODM & JDM cooperate to develop mobile phone related products
• 2. R&D and design of mobile phone fingerprint reader related products
• 3. Baseband, Power, Optic, Camera module for Smart phone R&D and design
• 4. Select, qualify and apply setup new component/part in BOM (Build of Material).
• 5. Set up layout guide and conduct review with layout engineer.
• Automotive:
• 1. MCU and power circuit of automotive electronic products.
• 2. Implement “risk management and analysis” methodologies (such as DFMEA) in design work.
• 3. Implement DFX methodologies – Design for Cost/Manufacturing/Quality, etc.
• 4. Study or be familiar with the design guide of IC/active component manufacturer (such as Qualcomm, Infineon, NXP, etc.).
• 5. Feasibility study for new product or new design specification and requirement.

• Supported analysis and monitoring of manufacturing schedules to enhance daily output and yield.
• Assisted in identifying causes of production issues and confirmed integration of process information.
• Contributed to ongoing improvements in production processes.