Ching-Fei Yuan

• VPG 800 relocation

Relocate the VPG from Kagoshima (Japan) to Kaohsiung ( Taiwan)
with Japanese colleague and finish the final acceptance.

• MLA 300 installation

Setup installation plan and collaborate with Germany colleagues to install 2 MLA 300.
The point of contact for customer, report the condition to HQ

• Customer service

Answered customer telephone calls promptly to avoid on-hold wait times.

• Streamlined troubleshooting processes for increased efficiency and faster problem resolution

• Lam Express installation

Work with TSMC facility engineers to do pre-installation.

Collaborate with Lam research engineers to install the Express and finish the acceptance.

• Sponsor for SPC chart (Lam Express)

Collaborate with mother Fab engineers to reduce false alarm around 15%.

• TEL Unity U/E improvement

Evaluate the 2nd source of U/E of Unity, this cost down improvement save the budget 1 million NTD/year.

• TEL 8500 particle improvement

Improve the contamination of wafer in TEL 8500, particle SPC chart’s Cp increase to 1.73 from 0.89

• Improve the capacity of Unity

Adjust the machine parameter like gap up/down speed, 4-pin speed and decrease the stable time of B/H of recipe. Increase the daily capacity

5 pcs/day for each machine.