I worked at ASE Group as a Bumping Process Product Engineer for nearly two years, focusing on the development and optimization of FOCoS (Fan-Out-Chip-on-Substrate) advanced packaging technology.
Learned and adhered to laboratory safety regulations while promoting individual responsibility within the team.
As a FOCoS Product Project Engineer in ASE Croup, my main responsibilities included:
1. Identifying customer requirements and ensuring engineering lots are delivered on schedule (SOD).
2. Evaluating the qualification capability of near-mass production products to ensure a smooth transition to mass production.
3. Conducting structural evaluations for Qualcomm’s new FOCoS device requirements.
4. Managing the mass production transition of Qualcomm’s new FOCoS device.
5. Handling customer complaints, providing rapid responses, and identifying root causes efficiently.
6. Collaborated with cross-functional teams to ensure seamless integration of product components.
Continuous improvement
Timeline management
Documentation preparation
Failure modes and effects analysis