Highly motivated and equipped with a master's degree in material science, possessing a strong passion for research and the ability to solve problems. Academic background in green energy technology and material analysis providing necessary skills in the manufacturing industry.
10 months of work experience in semiconductor packaging, developing a strong understanding of the production process and refining knowledge of assembly. Eager to apply expertise and enhance skills in a leading manufacturing company.
Key Projects and Achievements
Led the yield improvement project for total ball shear (TBS) solder ball connection tests, significantly enhancing product yield from 70% to 90%, reducing production costs by eliminating the need for new equipment purchase (NT 3,500,000 in equipment setup cost).
Assisted in the laser marking quality control and Encapsulant surface roughness improvement project by introducing new Epoxy Molding Compound materials and adjusting laser power, resulting in clearer marking quality and more competitive product appearance.
Competencies
Analytical Instrumentation Proficiency
Data Analysis Software
Others