Jerry Liu

• Joint development on CoWoS-R/L and SoIC process with R&D and transferring to mass production successfully.
• Applied customer feedback to develop process improvements and support long-term business needs of CoWoS-S.
• Developed and maintained relationships with customers and fab teams through weekly communication.
• Maximized performance by monitoring daily activities and mentoring team members.
• Recruited and hired top performers to add talent and value to department.

• Joint development on 5nm logic process with R&D and transferred to mass production successfully.
• Applied customer feedback to develop process improvements and support long-term business needs.
• Developed and maintained relationships with customers and fab teams through weekly communication.
• Maximized performance by monitoring daily activities and mentoring team members.
• Recruited and hired top performers to add talent and value to department.

• Performed statistical analyses to gather data for product yield improvement and fab cost reduction.
• Developed and maintained relationships with customers and fab team through weekly communication.
• Hosted and accomplished multiple tasks within established timeframes.
• Recruited and hired top performers to add talent and value to department.
• Evaluated employees' strengths and assigned tasks based upon experience and training.

• Worked with vendors to create industry 450mm tool standard specification.
• Worked with Intel/IBM/Samsung/GF/nano tech. SUNY Albany colleagues to build up worldwide 1st 450mm mini-line and deliver 1st 450mm pattern wafer.
• Participated in continuous improvement by on-site recipe development with Lam/AMAT engineers, engaging in problem-solving activities to support teamwork.
• Source inspected 1st TEL etch tool in Japan and conducted installation and process releasing in G450 fab.
• Learned different working culture from various companies to improve efficiency and productivity.

• Successfully transferred mother fab process to TSMC F10 to deliver competitive wafer yield and turned to mass production..
• Participated in continuous fast ramping in TSMC F10 by engaging in problem-solving activities with experience Etch knowledge to support teamwork.
• Resolved conflicts and working culture between China and Taiwan employees.
• Developed and driven local engineers and managers to well handle fab activities.

0.5/0.35/0.25/0.18/0.13um Etch process development and production.