Jesse Kuo

ATE Test Engineer / IC Test & Validation Engineer

Summary

10 years of experience in semiconductor testing, primarily utilizing Teradyne ATE platforms (UltraFlex, UltraFlex Plus, J750), encompassing: Hardware maintenance and debugging: Proficient in troubleshooting and repairing test systems to ensure optimal performance. System-level understanding: Deep familiarity with the architecture and operation of ATE systems. Test program development: Expertise in creating and optimizing test programs to meet specific testing requirements. Production support: Providing ongoing support during manufacturing to address and resolve any testing issues promptly. Data analysis and yield improvement: Analyzing test data to identify trends and implement strategies to enhance yield. Automation: Skilled in automating test processes to increase efficiency and reduce manual errors. Collaboration: Effective communication and teamwork with R&D, QA, FAE, vendors, and customers to deliver scalable test solutions and resolve complex device-level issues under tight deadlines.

Overview

years of professional experience

Languages

Work History

Manufacturing Test Engineer

Wipro (Contractor at NVIDIA)

08.2025 - Current

Directly reported to NVIDIA leaders, with full ownership of validation and test development responsibilities.
Develop and execute server-level test workflows leveraging Linux environments for validation and diagnostics.
Implement and optimize automated test scripts to improve efficiency, reproducibility, and coverage.
Collaborate with cross-functional teams (HW validation, system engineers, and vendors) to ensure test plan alignment and rapid issue resolution.
Support NPI introduction by integrating test procedures into mass-production readiness.
Troubleshoot system-level issues across DUT nodes, communication modules, and power delivery subsystems.

Manufacturing Engineer

DIS (Joint Venture of Teradyne and Technoprobe)

05.2024 - 08.2025

Lead test solution integration for IC packaging & final test using UltraFlex
Implement test plans, analyze data, tune test stability
Validate system performance, troubleshoot device-level issues
Provide customized ATE architecture, ensure NPI to MP transition

Manufacturing Engineer / Field Application Engineer

Teradyne

05.2021 - 05.2024

Develop/debug/deploy ATE programs on Ultra Flex/Ultra Flex Plus
Perform yield enhancement and root cause analysis
Maintain ATE systems, instrumentation, and calibration
Automate reporting and analysis using VBA/Macro tools
Liaison between R&D, FAE, and customer engineers
Lead test correlation and failure mode debugging

Senior Test Engineer

KYEC (King Yuan Electronics Co., Ltd.)

08.2016 - 05.2021

Maintain and repair Teradyne J750/UltraFlex ATE systems
Conduct board-level circuit debugging and component replacement
Monitor/debug MTK production yield
Validate test programs and integrate FT processes
Author technical reports and improvement proposals
Support production continuity by troubleshooting handlers, probers, sockets

Skills

ATE Platforms: Expertise in Teradyne UltraFlex, UltraFlex Plus, J750
Test Program Development: Skilled in new product introduction (NPI), signal integrity tuning, and test correlation
Hardware Troubleshooting: Load-board repair, schematic interpretation, instrument maintenance
Yield & Data Analysis: Top item analysis in mass-production products, identifying root causes, and effectively utilizing analytical tools

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Relevant Highlights

Automation & Test Development: We developed and customized test programs on Teradyne UltraFlex/UltraFlex Plus/J750 platforms, using Excel VBA to automate data acquisition, analysis, and reporting.
Hardware Test & Debugging: Hands-on experience in load-board repair, hardware calibration, instrumentation debugging (oscilloscope, multimeter), and system performance tuning.
Device Characterization & Data Analysis: Evaluated device performance and supported yield improvement initiatives (Bin Pareto analysis, trend tracking, root-cause identification) during NPI and mass-production phases.
Cross-Functional & Vendor Collaboration: Collaborated with R&D, QA, FAE, external vendors, and customers to validate metrology systems, improve test stability, and refine test protocols.
Delivery Under Tight Schedules: Proven ability to diagnose and resolve device-level test issues under time pressure, ensuring on-time production ramp-up and product launches.

Timeline