

I am a seasoned Product Engineering professional with nearly 9 years of dedicated experience in the semiconductor and module assembly industry. My career has evolved from a hands-on Engineer to my current role as a Department Manager, giving me a unique 360-degree view of product lifecycles—from NPI to Mass production.
Core Value Proposition:
I am now seeking to pivot back to a Technical Staff job, where I can apply my "managerial sense" to drive high-impact technical decisions and innovation within the Staff Packaging Engineer role.
Power Module & SiP Packaging
Failure Analysis & RCA
Cross-functional Coordination
Risk Assessment & Management
Analytical Tools(SPC/DOE/JMP/8D/FMEA)