MING-HSIEN ( Kad ) LEE

1. Lead plant process engineering team to support manufacture to achieve plant goal of line performance, process capability, cost reduction, and product quality.

2. Evaluate new products, process and make plan to deployment and development into plant.

3. Lead DMAIC / DESGN projects with a cross functional team and co-work with colleagues from various countries.

4. Cross-function relationship and communication enhancement

5. Deploy/ optimize current work force (people development)

1. Handling customer relationship with commercial team, and provide total solutions to improve internal products qualities and solve customer's technical problems with engineering support.

2. Advanced products deployment in TC plant, collaborated with product engineer, supply planning, manufacturing, logistic, and finance team.

3. Ramping up new lines with brand new process with operations, maintenance and research team.

1. Coordinated with Integration team to trace inline defects and find the root cause by Failure Analysis such as SEM, EDS, FTIR, TEM. We defined 15 different defects in 3 months, and provide corrective actions and preventive actions.

2. Used TEL ICP dry etcher in Via etching process, and improved contact resistance from ∞ to 15% better than target by DOE manner with RD team tuning MIRASOL display technology (MEMS based).

3. Fine tuned Stripper process to prevent AlCu from corrosional damage.

1. Evaluate new material IZO, fine tuned by DOE manner to get best process condition under the restrictive equipment status such as fewer process time then ITO process.

2. ITO etchant localization project, identified original etchant manufacturing process and ingredient, and use on-site equipment to fabricate by facility. Successuly Implemented self-made ITO etchant to current process. ( Cost reduction 70% per liter ).

3. G7.5 TFT Fab expansion, sourcing and evaluating ITO wet etcher and Concentration Monitoring Controlling System and handling the installation and capability ramp-up to mass production.