Luke Huang
Customer Service And Equipment-related Engineers
Kaohsiung & Tainan
Summary
Energetic Field Service Engineer with 4.5 years of semiconductor industry experience, including 1.5 years specializing in equipment repairs, installations, and troubleshooting. Committed to providing optimum service support through both remote and on-site assistance. Proficient in investigating and resolving common issues while delivering efficient, courteous, and professional repair services.
Overview
6
6
years of professional experience
2
2
Languages
Work History
Equipment Engineer (CP Test)
Micron
05.2025 - Current
- Resolved online production issues promptly and provided real-time updates to management.
- Deployed probe cards and optimized wafer measurement processes to achieve high-quality, high-volume output.
- Conducted routine particle qualifications and implemented 6S and Total Productive Maintenance (TPM) practices to ensure tool stability and cleanliness.
Field Application Engineer (AMC Detection)
Pfeiffer Vacuum
05.2024 - 09.2024
- Delivered technical support for TSMC AMC (Airborne Molecular Contamination) detection equipment.
- Led a rapid software upgrade project for TSMC tools, completing updates on 20+ machines across Taiwan within one week.
- Executed software and hardware CIP to enhance system performance and reliability.
- Coordinated with overseas headquarters to resolve complex troubleshooting cases.
Field Application Engineer (AOI)
V5 Technology
03.2023 - 12.2023
- Integrated AI-based wafer defect detection models into Automated Optical Inspection (AOI) systems.
- Led the development of a new wafer defect detection model in collaboration with R&D and successfully deployed it to clients within six months, improving defect detection accuracy.
- Maintained AI servers and performed routine software version upgrades to ensure stable system performance.
Process Engineer (Backside Grind)
ASE
10.2019 - 10.2022
- Managed online production and experimental lots, and performed evaluations on various materials.
- Collaborated with EE, IT, and vendors to integrate plug-in inspection tools, improving WPD (wafers per day) and increasing the operator-to-machine ratio from 1:4 to 1:10.
- Led the expansion of a new facility with six grinding and three tapping machines, implementing new SPECs and OCAP to standardize operations.
Education
Bachelor of Science - Chemical and Materials Engineering
National Kaohsiung University of Science and Technology
06.2017
Master of Science - Chemical and Materials Engineering
National Kaohsiung University of Science and Technology
06.2019
Skills
Wafer defect detection
Failure modes and effects analysis
Equipment troubleshooting
Teamwork and collaboration
On-site support
Customer service
Timeline
Equipment Engineer (CP Test)
Micron
05.2025 - Current
Field Application Engineer (AMC Detection)
Pfeiffer Vacuum
05.2024 - 09.2024
Field Application Engineer (AOI)
V5 Technology
03.2023 - 12.2023
Process Engineer (Backside Grind)
ASE
10.2019 - 10.2022
Master of Science - Chemical and Materials Engineering
National Kaohsiung University of Science and Technology
Bachelor of Science - Chemical and Materials Engineering
National Kaohsiung University of Science and Technology
Similar Profiles
Wan Lin YiWan Lin Yi
OMT QE IQC Engineer Lead at MicronOMT QE IQC Engineer Lead at Micron
Steven YangSteven Yang
Manufacturing Engineer at MicronManufacturing Engineer at Micron
Logesvaran KaliappanLogesvaran Kaliappan
Senior Manager at MicronSenior Manager at Micron
Nepi Trimuningsih (寧平）Nepi Trimuningsih (寧平）
English Teacher (Part-time) at Bi Sheng Cram SchoolEnglish Teacher (Part-time) at Bi Sheng Cram School
Richelle EnclonarRichelle Enclonar
Factory Worker at ChipMOS TechnologiesFactory Worker at ChipMOS Technologies