Neil Tsai

Product Introduction Experience

• Led mass production ramp-up for LED and power fuse module (PCBA), establishing end-to-end packaging process flow and release control
• Successfully launched TVS SSP into mass production, completing design validation, prototype, and pilot production
• Replaced traditional sputtered FSM with electroless plating (chemical Ni/Pd/Au), achieving successful trial build and material cost reduction

Advanced Process Development

• Co-developed non-Taiko BGBM process with supplier and released into mass production with qualified electrical and reliability results
• Designed and implemented BSM pattern process using non-lithographic methods, improving electrical path uniformity and structural consistency

Supplier Qualification & Evaluation

• Drove new product development through collaborative package design and technical requirement alignment with OSAT and internal teams
• Defined and validated packaging process specifications with suppliers to meet manufacturing and reliability standards
• Managed NPI-to-MP documentation deliverables including BD, BOM, POD, and detailed process specs
• Introduced and qualified suppliers for PI, FSM, chemical Ni/Pd/Au, BGBM, and wafer saw; managed technical transfer and risk mitigation during ramp
• Supported SQE-led pre-production audits to validate process readiness, stability, and yield performance

Process Improvement & Yield Enhancement

• Resolved void issues in FSM process through DOE-based layout optimization and material stack tuning
• Partnered with suppliers to enhance wafer-level MOSFET packaging process, improving yield from 95% to 98% and reducing defect rates
• Optimized wafer saw conditions to reduce mechanical damage, lowering yield loss from >5% to

• CAR Leadership for Quality Issues:
  1.Spearhead the completion of Corrective Action Reports (CAR) addressing quality concerns with Foundry/Bumping house suppliers.
  2.Identify root causes and orchestrate effective actions for sustainable quality enhancement.
• Product Quality Review:
  Conduct comprehensive product quality reviews, encompassing manufacturing metrics, inline process control, Statistical Process Control (SPC), line yield, and Failure Mode and Effect Analysis (FEMA) at foundries and Bumping houses.
• CIP Task Force:
  Actively contribute to Continuous Improvement Process (CIP) task forces, driving initiatives that enhance operational efficiency and elevate product quality standards.
• New Supplier Evaluation :
  Lead the assessment of new suppliers , ensuring a robust evaluation process and successful integration.
• Failure Analysis and Corrective Action:
  Direct failure analysis efforts and corrective actions in collaboration with vendors (foundry), taking charge of Return Merchandise Authorization (RMA) processes.
• Supplier Performance Monitoring:

Regularly monitor supplier performance metrics, including line yield, SPC, CpK, IQC, driving systematic improvements at Foundry and Bumping House.

• Audit Management:

Oversee the coordination and execution of annual audits, ensuring compliance, and support customer audits to uphold high-quality standards for suppliers.

• Achieve a cost reduction about 2% of slurry for mass production.
• Evaluate new parts and process conditions to improve uniformity performance from 15% to 10 or less.
• Decrease troubleshooting rate about 3% by analyzing data and implementing measures properly.

• Led NPI for RDL, WLCSP, and Cu pillar products; compiled FMEA and defined packaging design rules
• Standardized production processes, reducing cycle time by ~10% and decreasing customer complaint rate from 10% to 3%
• Coordinated across departments for technology roadmap development and issue resolution

• Introduced new photoresist materials for advanced packaging
• Collaborated with vendors on chemical resistance and reliability testing
• Evaluated new equipment and developed corresponding process recipes, OCAPs, and documentation