M.S. - Mechanical Engineering
Southern Taiwan University of Science and Technology
Tainan, Taiwan 2025 - Current
Qian-Yu Yi
Tainan
Summary
Master's student in Mechanical Engineering at STUST, focusing on MEMS thin-film gas sensors, semiconductor micro-fabrication, and materials characterization. Experienced in cleanroom processes (trained at TSRI), sensor characterization, and hardware layout integration, backed by National Technician (Level B & C) and Siemens CSEA drafting certifications, with findings recognized by a First-Author SCI publication and an ISAT-24 presentation award in Japan.
Education
B.S. - Mechanical Engineering
Southern Taiwan University of Science and Technology
Tainan, Taiwan 2022 - 2025
Skills
Design & Spatial Layout
- 2D/3D Precision Drafting, Tolerance Design, 3D CAD Modeling
- Software: AutoCAD, Inventor, Solid Edge
Semiconductor Micro-Fabrication
- Thin-Film Deposition: Magnetron Sputtering, PECVD
- Patterning & Etching: Photolithography (Contact Aligner), Dry Etching (ICP-RIE), Wet Etching
- Cleanroom Protocol, Packaging & Testing Methodologies
Certifications & Professional Training
- Siemens Solid Edge Certified Associate (CSEA)
- Level B & C Technician: Computer-Aided Mechanical Drafting (Ministry of Labor, Taiwan)
- Level C Technician: Computer-Aided 3D Solid Modeling (Ministry of Labor, Taiwan)
- Cleanroom & Advanced Processing Equipment Training Certificate (20 Hours) (Taiwan Semiconductor Research Institute, TSRI)
- Semiconductor Packaging & Testing Competency Certificate (MEIMING Tech, Taipei Tech & NKUST Collaboration)
Research Projects
Next-Generation Low-Power MEMS Gas Sensor Development
Apr 2024 – Aug 2026
- Micro-Fabrication & Cleanroom Operations: Completed full micro-fabrication cycles for MEMS sensor chips, including photolithography (coating, alignment, exposure, development), wet etching, and ICP dry etching for oxide/metal layers.
- Thin-Film Deposition: Operated PECVD for oxide layer deposition and magnetron sputtering for functional metal and metal-oxide thin films.
- Module Integration & Circuit Verification: Designed physical layout integration between sensor chips and peripheral interface circuits, ensuring low-noise signal transmission and mechanical stability.
Timeline
B.S. - Mechanical Engineering
Southern Taiwan University of Science and Technology
2022 - 2025
M.S. - Mechanical Engineering
Southern Taiwan University of Science and Technology
2025 - Current