

Experienced semiconductor engineer with strong expertise in gallium nitride (GaN) power devices, specializing in the processing and fabrication of high-electron-mobility transistors (HEMTs). Skilled in developing and optimizing cleanroom process flows, including lithography, etching, metallization, passivation, and gate stack engineering. Proficient in advanced electrical characterization techniques such as I–V, C–V, pulsed I–V, and breakdown analysis to evaluate device performance. Experienced in reliability testing and failure analysis, with a focus on threshold voltage stability, off-state leakage, trapping effects, and long-term degradation mechanisms. Demonstrated ability to link fabrication processes with electrical performance through systematic data-driven analysis. Hands-on experience with wide-bandgap semiconductors, addressing challenges in epitaxial design, thermal management, and normally-off operation. Adept at problem-solving, process optimization, and implementing solutions to improve device yield and reliability. Highly motivated to apply technical expertise to industry-focused development and advanced R&D projects.
Experienced researcher having expertise in semiconductor devices with emphasis on
Device fabrication in Class-100 clean-room environment
Temperature-dependent electrical characterization
Surface analysis through microscopy techniques
Reliability study due to defect formation in devices
Interface engineering
Formulation of test structures using TCAD
Modeling of measured data
Design of sensors for physiological applications
Device Design and Modeling: TCAD Silvaco, Comsol, Verilog, Mentor Graphics, Cadence, Xilinx
Programming: C/C, MATLAB, Origin C
Semiconductor mandarin certification
Exploring and collecting unique scents as a creative and sensory-driven personal hobby.
Semiconductor mandarin certification
Advance Processing Equipment, TSRI
Processing for VLSI Technology, TSRI