ERIC CHENG

Managing suppliers' manufacturing operation, and bring up NPI programs to a mass production scale.

• Actualized Universal AVI solution by deploying AI-based inspection algorithm. This initiative established generalizability in vision task across product iterations and implemented in the scale of 30 millions shipments.
• Led Smart Factory initiative, including factory digitalization and set up Tableau dashboard for tracking and compare factories operational metrics.
• Built recycle plastic framework, including process and testing requirements. Qualified recycle plastic for iPhone 16 cameras.
• Lunched first 5x zoom telephoto camera for iPhone 15 Pro Max, and first auto focus function in front camera in Phone 14 lineup.

• Scale up the manufacturing capacity to 157% in a year for surging business.
• Led engineering team's outcomes to be in line with business needs covering quality, delivery and cost aspects.
• Introduced infrared ray inspection method to tape & reel process. This technology enabled in-process detectability of inner crack in silicon chips, which had been intrinsic challenge for years.
• Trained cross-functional team members on NPI best practices to foster a consistent approach across all departments involved in product development.

• Lunched 12 NPI projects to mass production.
• Developed Smart Dicer solution by introducing innovative acoustic sensors and big data computational platform. This initiatives laid the groundwork for concept of predictive process control in wafer dicing process.

• Enabled grinding capability for Wafer Level Chip Scale Package in 2014. This project allowed NXP Taiwan to operate turnkey flow for this emerging package which climbed to 30% of annual revenue in 3 years.
• Conducted root cause analysis to identify, prioritize and eliminate process losses.

• Designed 2 x new linear guide products
• Developing outsourcing manufacturing, and conducting pilot run to verify the stability of manufacturing.