TB An

Possess a deep understanding of sensor and actuator physics and MEMS technology. Specialized in evaluating MEMS device wafer process integration and enhancing yield on large volume consumer devices. At Texas Instruments, led cross-site meetings and spearheaded initiatives to resolve wafer and assembly processes defects; contributed annual cost savings exceeding $1M. At TSMC and APM, developed MEMS device wafer process integration (motion sensor, microphone, force sensor and scanning mirror) and published 2 patents.

IATF16949 Lead auditor certificate (by Plexus International)

• First author of “MEMS wafer structure and manufacturing method thereof” (#106140670, Taiwan)
• Co-author of “Outgassing material coated cavity for a mirco-electro mechanical system device and methods for forming the same” (#20210246014, U.S.)

• Novel methods of wire bond yield improvement on DLP Products.
• Systematic FA for mirror defects of DLP Products, 2020
• Anti-stiction improvement for micro-electro-mechanical-system DLP device, 2019

• First author of “MEMS wafer structure and manufacturing method thereof” (#106140670, Taiwan)
• Co-author of “Outgassing material coated cavity for a mirco-electro mechanical system device and methods for forming the same” (#20210246014, U.S.)

• Novel methods of wire bond yield improvement on DLP Products.
• Systematic FA for mirror defects of DLP Products, 2020
• Anti-stiction improvement for micro-electro-mechanical-system DLP device, 2019