Tzu-cheng Kuo
NPI Engineer (New Product Introduction Engineer)
Yangmei Dist.
Summary
Product Development Engineer with over 2 years of experience in semiconductor packaging industry, focusing on New Product Introduction (NPI) and project coordination. Successfully completed more than 20 product ramp-up projects and supported over 7 fabless semiconductor customers. Experienced in cross-functional collaboration across Manufacturing, Quality, Planning, and Engineering, with strong capability in customer communication, problem-solving, and production issue resolution to ensure smooth product ramp-up and delivery.
Overview
1
1
Certification
8
8
years of professional experience
Work History
Customer Engineering Integration
ADVANCED SEMICONDUCTOR ENGINEERING INC. CHUNG-LI BRANCH
11.2024 - Current
New Product Introduction (NPI) / Program Management
• Led New Product Introduction (NPI) projects and ensured successful transition from development to mass production within customer-defined timelines.
• Managed APQP activities throughout the product lifecycle, including quotation review, engineering development, product qualification, and safe launch readiness; supported automotive product validation in compliance with AEC-Q requirements.
• Coordinated cross-functional teams across R&D, procurement, manufacturing, and quality teams to drive project execution, mitigate risks, and achieve on-time product launches.
• Served as the primary customer interface for product roadmap alignment, technical communications, audit support, and issue resolution, fostering strong customer relationships and ensuring customer satisfaction.
Process Engineer
ADVANCED SEMICONDUCTOR ENGINEERING INC. CHUNG-LI BRANCH
09.2023 - 12.2023
- Assisted the production line in identifying sites causing defects, adjusted parameters to improve issues, and continued tracking on a weekly basis.
Campus Club Cadre Training Manager
Chang Gung University
10.2020 - 10.2020
- 200 college students were convened to conduct three days and two nights of team activities for promoted cadres of various societies to promote communication among the societies and generate novel cooperation ideas.
Class President
Chang Gung University
09.2018 - 06.2020
- Hosted class meetings to facilitate communication between teachers and students, enhancing collaboration within the school.
Education
Master of Science - Mechanical Engineering
Chang Gung University
Taoyuan06-2023
Bachelor of Science - Mechanical Engineering
Chang Gung University
Taoyuan06-2022
Skills
Automotive product validation
New Product Introduction
Program management
Cross-functional collaboration
SolidWorks
AutoCAD
Certification
IPAS Certified Junior PCB Process Engineer (MOEA, Taiwan)
Timeline
Customer Engineering Integration
ADVANCED SEMICONDUCTOR ENGINEERING INC. CHUNG-LI BRANCH
11.2024 - Current
Process Engineer
ADVANCED SEMICONDUCTOR ENGINEERING INC. CHUNG-LI BRANCH
09.2023 - 12.2023
IPAS Certified Junior PCB Process Engineer (MOEA, Taiwan)
12-2021
Campus Club Cadre Training Manager
Chang Gung University
10.2020 - 10.2020
Class President
Chang Gung University
09.2018 - 06.2020
Master of Science - Mechanical Engineering
Chang Gung University
Bachelor of Science - Mechanical Engineering
Chang Gung University
PUBLICATIONS
- Master's thesis: Evaluation of Thin Silicon Die Bending Strength by Ring-on-Ring Test: Experiment, Theory and Simulation
- Journal paper Co-Author: A Comparison of Biaxial Bending Strength of Thin Silicon Dies in the Ball-on-Ring and PoEF Tests Transaction of ASME Journal of Electronic Packaging, Sept. 2023.
- Correction factors to biaxial bending strength of thin silicon die in the ball-on-ring test by considering geometric nonlinearity and material anisotropy Journal of Mechanics, Volume 39, 2023, Pages 320–333, September 2023.
COURSES
- Sep 2020 - Jan 2021 Introduction to Electronic Packages Chang Gung University
- Feb 2021 - Jul 2021 Composites Mechanics Chang Gung University
- Feb 2022 - Jul 2022 Finite Element Method Chang Gung University
Publications
- Master's thesis:
《《Evaluation of Thin Silicon Die Bending Strength by Ring‑on‑Ring Test: Experiment, Theory and Simulation》》
- Journal paper Co‑Author:
《《Biaxial bending strength of thin silicon dies in the ring-on-ring test by considering geometric nonlinearity and material anisotropy》》Materials Science in Semiconductor Processing, Feb, 2025.
《《A Comparison of Biaxial Bending Strength of Thin Silicon Dies in the Ball‑on‑Ring and PoEF Tests》》Transaction of ASME Journal of Electronic Packaging, Sept. 2023.
《《Correction factors to biaxial bending strength of thin silicon die in the ball‑on‑ring test by considering geometric nonlinearity and material anisotropy》》Journal of Mechanics, Sep. 2023.