WANG PAUL
Field Service Engineer
Taipei City,TPE
Summary
Detail-oriented Semiconductor Professional with expertise in advanced lithography and wet process systems. Proven ability to enhance fab operations through collaboration with client engineers and internal teams, ensuring adherence to safety standards and tool readiness. Committed to supporting installation projects and advancing technical skills to drive success at Applied Materials.
Overview
1
1
Language
7
7
years of professional experience
Work History
Filed Service Engineer
Lam Research
09.2024 - Current
- Execute tool installation, modification, and performance tuning to support customer fab production requirements.
- Conducted failure analysis on technical issues with cross-functional and customer engineering teams, minimizing tool downtime.
- Executed tool installation, modification, and performance tuning, enhancing support for customer fab production requirements.
Upgrade Install and Relocation Engineer
ASML
09.2021 - 07.2024
- Upgrading Machine Modules and executing system recovery , while maintaining customer communication.
- Install ASML (DUV) at customer site ,testing and troubleshooting any encountered issues , adjusting the machine to meet client's specifications.
- Multifunctional to support different roles include : hardware/installation/recovery engineers and coordinator.
Thermal Engineer
Compal Electronics
Taipei City, Taiwan
11.2019 - 08.2021
- Designed and evaluated thermal module of notebook to optimize system performance
- Executed research and development phase to verify product functions and ensure product integrity
- Designed thermal management systems for electronic devices, enhancing performance and reliability.
- Conducted thermal simulations using ANSYS to predict heat dissipation in product designs.
- Collaborated with cross-functional teams to optimize cooling solutions and reduce overheating risks.
Education
Bachelor of Science - 機械工程
淡江大學
新北市 04.2001 -
Master of Science - 機械工程
陽明交通大學
新竹市 04.2001 -
High School Diploma -
師大附中
台北市 04.2001 -
Timeline
Filed Service Engineer
Lam Research
09.2024 - Current
Upgrade Install and Relocation Engineer
ASML
09.2021 - 07.2024
Thermal Engineer
Compal Electronics
11.2019 - 08.2021
Bachelor of Science - 機械工程
淡江大學
04.2001 -
Master of Science - 機械工程
陽明交通大學
04.2001 -
High School Diploma -
師大附中
04.2001 -