Dear sir:
My name is Wei-Chih Hsiao. I worked as a thin film process engineer in a 12-inch wafer fab. Usually the work is mainly to maintain the condition of the machine. Often requires cross-departmental collaboration and has experience in working with vendor to inspect and accept machines. Therefore, I am very familiar with how vendor and customers work together.
With these experiences, I became more and more interested in installing and repairing machines. I really hope to work in ASML.
Provided training courses for Taiwan Semiconductor Research Institute.
Diffraction analysis technology, scanning analysis technology, surface chemical analysis technology, and various microscopy sample preparation.
TEM, SEM, OJ, XPS, XRD, SIMS, SPM, differential Hall measurement, FT-IR, Raman spectrometer, etc...