Wei Tsan Hung

Introduction of new products from the development stage to HVM and improvement of product yield.

• Production documentation: Manufacturing SOPs, process OCAP, equipment conversion checklist.
• Product quality control: Evaluation and definition of FDC and SPC system specifications, assisting in the automation development for manual quality verification.
• Process capability and yield enhancement: Adjustment of process parameters, evaluation, and setup of new machines, and software upgrades for equipment.

Projects:

• HBM3 plus IQP yield improved from 0% to 96%.

Due to changes in warpage performance of the HBM3 cube and interposer die, the original process is no longer applicable. Interposer to substrate joint capability was enhanced by changing the flux dipping depth (38um to 50um). While cube transitioned from reflow process to TCB process to overcome the edge non-wet issue.

• Development of new IQP machine for process improvement from other site.

Collaboration with KEG for Equipment Development. Tansitioning manual operation machine to machine which can auto run for production, and establishing a new process profile for the new equipment.

• Stacking process owner for tack bond.

Inline yield improvement: Lowered die placement scrap rate by modifying the machine speed ratio.

Stacking issue improvement: Set up FDC chart to detect double die issues. Collaborated with EE for a software upgrade to enable early detection of double die pick-up from the machine.

• Development of Systematic Quality Verification.

Assisted in the development of measurement equipment and ADC systems to upload quality verification results to the SPC system, enabling automatic assessment of machine quality for production qualification, replacing manual judgment.