Yao Tsun Yu

As a Staff/ Senior II Process Engineer, I ensure seamless production, continuous improvement, and the application of lean methodologies to enhance yield and optimize CPK values. My key responsibilities include:

• Overseeing the Wire Bond sections, including KNS CONNX ELITE, ESEC, UTC and ASM Machine Platforms.
• Addressing and resolving daily production technical issues to ensure uninterrupted production flow.
• Leading continuous improvement initiatives within the workshop using lean methodologies.
• Managing quality issues in collaboration with the Quality Assurance Department, employing Plant Lean methodology (QRQC) to resolve and contain problems.
• Working closely with Engineering and R&D departments to transition new processes and technologies into the production line in a timely manner.
• Driving continuous improvement in the Wire Bond sections to enhance Overall Equipment Effectiveness (OEE).
• Steering the organization towards achieving company KPIs (Key Performance Index) and internal PPM targets.
• Deploying Statistical Process Control (SPC) on processes to optimize CP/CPK values.
• Ensuring safety, discipline, and adherence to 5S standards.
• Establishing and updating documentation on process parameters and work instructions.
• Providing training to employees on new processes and technologies.

• Improved product quality by conducting root cause analysis on process deviations and implementing corrective actions.
• Led continuous improvement initiatives using Kaizen and/or Lean Six Sigma methodologies, resulting in significant process enhancements.
• Developed simulation models to analyze process performance, enabling better decision making for operational adjustments.
• Provided expert troubleshooting support during critical plant issues, quickly resolving incidents while minimizing production losses.
• Conducted regular audits of process safety management systems to ensure compliance with regulatory requirements and industry best practices.
• Reduced operational costs by identifying inefficiencies within existing processes and recommending improvements to management.
• Optimized resource allocation across multiple tasks by effectively prioritizing workload based on deadlines or urgency levels.
• Initiated process improvements that resulted in increased efficiency and cost savings for the organization.
• Supported professional development of team members by regularly sharing best practices, encouraging ongoing learning, and promoting culture of continuous improvement.
• Evaluated employee performance regularly, providing constructive feedback and opportunities for skill development or growth when necessary.
• Established positive relationships with customers and other staff members.
• Established and maintained strong relationships with colleagues through regular meetings and communication.

• Modified production processes to reduce non-conforming material occurrences.
• Created series of process optimizations to reduce production errors and increase quality.
• Increased product yield by implementing improved processes.
• Developed and launched new product line, resulting in increased revenue.
• Optimized processes to reduce cost and increase efficiency.
• Participated in project reviews to enable ongoing status tracking and reporting.
• Analyzed critical line data to make recommendations for improvement.
• Prepared scope of work documentation for use in project planning
• Developed documentation, diagrams, and specifications to meet project requirements and regulatory standards.
• Interfaced with area teams to verify application of technical details.
• Provided technical assistance to production team when issues arose.
• Visited client sites to troubleshoot issues and provide one-on-one training.
• Conducted root cause analysis to identify, prioritize and eliminate process losses.
• Coached newly hired employees and interns while observing progress and delegating tasks.
• Created process simulations to test operational outcomes without causing service disruptions.
• Developed conceptual scope analyses of project objectives.
• Met weekly with team members to discuss project implementations and alleviate any issues.
• Reviewed processes, identifying areas requiring improvement.
• Performed test production runs to identify and execute needed adjustments
• Read and analyzed work orders to determine machine and equipment settings and product specifications
• Maintained production records such as quantities, dimensions, and thicknesses of process materials
• Evaluated and measured completed materials and products to verify conformance to specifications
• Monitored machine operations to detect malfunctions and resolve problems
• Identified issues, analyzed information and provided solutions to problems
• Used strong analytical and problem-solving skills to develop effective solutions for challenging situations

• Working closely with global leading semiconductors on packaging and production.
• NPI Product Setup (Change structures, material and etc...)
• Analyze and solve product issues.
• Improve MTBA & workability.
• Good knowledge of semiconductor physics, technology and IC packaging processes
• Contribute to new product introduction risk assessments to advise mandatory improvement projects in domains of wafer test processes and probe card technologies.
• Providing clear and concise documentation for transfer of developed processes into high volume manufacturing (HVM) environment.
• Providing feedback and direction to equipment and material suppliers
• Collecting data and reporting on process maturity: including experiment designs, experiment results, windowing DOEs, process limits, process data and SPC
• Executed entire assembly process by accurately interpreting work orders, set-up sheets and drawing.
• Closely inspect parts to ensure they are free of contaminants, Thermoset Adhesive Die Attach( Clean room environment).
• Obtained appropriate tooling and fixtures.
• Working on K&S PROCU Wire Bonding machine.
• Working on K&S PROCUPLUS-LA Wire Bonding machine.
• Working on K&S ICONNPLUS Wire Bonding machine.
• Working on K&S RAPIDMENLA-PLUS Wire Bonding machine.
• Working on K&S RAPIDMEN Wire Bonding machine.
• Working on Sinkawa - 2000 Wire Bonding machine.
• Working on Sinkawa - 2000S Wire Bonding machine.
• Working on Sinkawa - 3000 Wire Bonding machine.
• Working on Panasonic Plasma Cleaning machine.
• Working on March Plasma Cleaning machine.
• Working on Templa Plasma Cleaning machine.
• Worked on DB-700 Die Attach machine.
• Worked on DB-800 Die Attach machine.
• Worked on 7000P Die Attach machine.
• Wire Bonding with 15um Au, 17.5um Au, 20um Au (Gold wire).
• Wire Bonding with 20um AG (Silver wire).
• Wire Bonding with Cu (Copper wire)
• Working on Thermocompression bonding.
• 2 Years ordering Gold wires, Silver wires, Copper wires and capillaries.
• Working on SEM (Scanning Electron Microscope).
• Optimized and track yield and MTBA of new products.
• Draw up cost down proposal.
• Work on Microscope.

• Directed incoming calls to internal personnel and departments, routing to best-qualified department.
• Supported customers by managing 100 calls per day efficiently while maintaining professionalism and upbeat tone.
• Attended safety training meetings to learn procedures for handling medical and fire emergency calls.
• Maintained up-to-date knowledge of emergency call procedures.
• Connected callers with appropriate professional, department or business.
• Analyzed user-generated trouble tickets to determine causes of problems and took appropriate action for resolution.
• Diagnosed and resolved complex integrated customer issues for implementation, add-on, maintenance and support of voice, data, VoIP and CTI applications.
• Responded to service requests during and after business hours.
• Researched and recommended network and data communications hardware and software.
• Coordinated installation of new users and relocations of existing users.