Yen Chi-Yu

Key Products: Rugged Laptop Series, Military-Grade Handheld Tablet.
Primary Duties: Mechanical development for full product lifecycles, from RFQ/EVT to MP sustaining.Focus on structural ruggedness, waterproofing design, and mass production optimization.

Key Achievements
1. Cost Down & Innovation
Design for Assembly (DFA): Transitioned module fixation methods from screws to snap-fit structures. Validated structural integrity via RSV, successfully reducing BOM cost and shortening assembly cycle time.

Space Optimization: Improved connector design by replacing physical Board-to-Board (BtB) connectors with Pad & Spring contact solutions, effectively reducing stack-up height and costs.

UX Improvement (Wobble Reduction): Innovated a "Hollow Design" for rubber feet to address device wobble issues. Validated through testing, this design effectively absorbs assembly tolerances and surface unevenness.
Result: Thoroughly resolved the wobble pain point and successfully implemented the design into mass production.

2. Quality & Failure Analysis

Yield Improvement: Spearheaded an IP68 leakage analysis project. Utilized DOE and tolerance reallocation to identify waterproof path vulnerabilities and resolve adhesive interference issues.
Result: Drastically reduced air leakage defect rate from 20% to 0.04% during the trial run phase, ensuring successful mass production.

Tooling & Molding Solutions: Resolved structural cracking issues at screw bosses. Identified weld lines as the root cause through analysis and collaborated with suppliers to modify gate designs and molding parameters, eliminating structural weaknesses.

3. Collaboration & Automation

Design for Automation: Modified component guiding features and assembly tolerances to align with factory automation transformation, ensuring smooth vacuum suction pickup (pick-and-place) and high assembly yields.

Cross-Functional Collaboration: Collaborated closely with Thermal and EE teams to optimize cooling airflow paths for high-heat sources within limited spaces.