Familiar with N4X, N28, N20 to N7 process flow and well dispatch for ETCH/Litho area
Metrology (SCD/CDSEM/OVL) inhibition status sponsor Metrology average waiting time improve 15%, inhibition rate drop 20%
ETCH area transfer time improve 30 secs
Introduce new transfer system 'ROVER' in TSMC
N80/90 production line planner logic production CT drop 0.1, clip rate keep 100%
New Tech N90 eFlash ramp up MFG sponsor Capacity from 1K to 6K
N7 clip rate from 75% to 100% in 6 months
Project: Lot size sponsor lot size from 18.9 to 21.1 per lot
Project: Align to best productivity improve 3%.
Bumping MFG supervisor
TI (Texas Instruments)
08.2011 - 03.2012
QFP & WCSP supervisor WCSP cycle time improve 0.5 day
Die prepare center & Mount center supervisor set SOP for DPC & MPC
E-operation card implement reduce manual and miss operation.
Education
Master - Department of Industrial engineering & management
National Chiao Tung University
08.2008 - 05.2010
Bachelor - Department Mathematical Sciences
National Chengchi University
09.2004 - 05.2008
Skills
Operations Management
KPI Tracking
Strategic Planning
Employee Coaching
Additional Information
I am the eldest child in my family. My parents let us express freely in our learning process and gave us timely direction and advice. As a result, I have become an independent person with strict discipline toward myself. I graduated from National Chiao Tung university and major in industrial engineering. My research is about the Data Envelopment Analysis (DEA). DEA is the mathematical model that uses multi-objective planning to solve production problems. Due to my interest in mathematics, I took Theory of constrain and queuing theory in school, which is useful for me to enter workplace. After graduating from graduate school, I joined TI for 8 months and TSMC for 10 years. I started as in line supervisor to learn how to manage the production line, check tool efficiency and dispatching, as well as managing DL on site. After about 2 years, I was assigned a new job to improve the AMHS system in etch area and introduce the new transfer system rover to the fab. In 2015, I rotated to planner in charge of the managing production line for clip on time delivery. I need to control whole process and deliver the wafers ordered by each customer on time. I also ramp up the specialty production line N90 eflash capacity from 1K to 6K per month. From 40nm I followed TSMC to ramp up to 7nm. I chose to leave company where I worked for 10 years after reaching the peak of 7nm and completing the tasks at hand. After 7 years in production planning filed, I join the Talus Manufacturing (fully owned by Lam Research) to be Material planner. MRP handle and material rolling forecast is my major job. I need to choose planning BOM for different customer to prepare material base on order for future 1 years. The match rate is around 90%. I also need to forecast 2 years material demand for different lead time and better scale price to issue the Procurement request. I believe that I can continue contribute the knowledge I have learned during my 11 years in the semiconductor industry and the work attitude that TI, TSMC and Talus has taught me in my future career. I would like to demonstrate my ability to continue to work with my future company to accomplish one task after another.
Capability
Certification for professional Test on Trust Businesses, Proficiency Test for Bank Internal Control and Audit, TOEIC: 770, Production planning, Capacity planning, MRP, Demand and Material rolling FCST, Data analysis and performance evaluation, Automated Material Handling System, SOP define
Timeline
Senior Operation Manager
Coupang Taiwan
12.2023 - Current
Material planner
Talus Manufacturing (owned by Lam Research)
07.2022 - 06.2023
Production Planner
TSMC
04.2012 - 01.2022
Bumping MFG supervisor
TI (Texas Instruments)
08.2011 - 03.2012
Master - Department of Industrial engineering & management
National Chiao Tung University
08.2008 - 05.2010
Bachelor - Department Mathematical Sciences
National Chengchi University
09.2004 - 05.2008
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