Ying Chih Wu

I majored in the Electrical or Electronic Engineering from bachelor to PhD and bring good research and development to get track in jobs well. And have 25-years working experience in the fields of assembly engineering, IC testing, product qualification, reliability tests, failure analysis and Lab management. During be a BGA engineering team leader, I need to perform the troubleshooting and define the strategy for production line. Any deviation or customer complain should be fixed immediately. Wide thinking, discussion to enhance the knowledge and information are very important before making the decision. Therefore, I maintain a positive and active learning attitude afterward. IC testing is another field, I plan to have full range know-how and technology at backend manufacturing. During the years of test engineer, I learned much experience on programming and PCB relation. And then applied my learning to improve test yield through material analysis on test socket and PCB board debug. 10 years working experience at backend support me to deal with problem on reliability successfully. I have 12 years working experience on package and board level reliability tests up to now. In NXP, I led a reliability team in PQC (Product Quality Center), define the roadmap and co-work with other sites (incl. Lab at Nijmegen, Austin, Tianjin). In Vishay, I am a division reliability & FA manager and work with 3 Labs in Shanghai, Kaohsiung and Manila. Substrate is a key and complicated material in package. In order to have deep learning on substrate. I go to Kinsus to be a senior manager and manage 4 reliability/FA Labs in Taiwan. And deal with intractable problem from customer. Currently, I lead 3 engineers and 207 technicians at Chemical and Surface Analysis Labs in TSMC. There are 12 Labs and throughout Hsinchu/Taichung/Tainan science industrial parks. I also support some engineering project in reliability Lab. My personalities are optimistic, thoughtful, easygoing, getting along with people easily and emphasize ethics. I love learning, and highly self-achievement. So I do my best in job, and getting fun from them. I do believe I am the best choice. I’ll desire to put all my learning, sharing and contribute all my strength and enthusiasm. It signifies a heartfelt anticipation of serving. Thanks for considering my application.

• Product Reliability, Qualification and Failure Analysis
• Package and Board Level Reliability Engineering
• Assembly Engineering and IC Testing
• Excellent Handling & Management on Customer Complaint

• High-speed signal transmission in PCB, 10/2021, FA, TPCA, Taoyuan
• Destructive analysis and investigate intermetallic compound, 04/2021, FA, TPCA, Taoyuan
• Green belt certification, 12/2017, Quality, NXP, Kaohsiung
• Micro step training for problem solving, 07/2017, Quality, NXP, Kaohsiung
• Wafer Fab process training, 07/2017, Fab process, NXP, Kaohsiung
• BLR competence development, 11/2016, Reliability, NXP, Kaohsiung
• ELITE (Enhanced Lock-In Thermography) certification, 01/2016, FA, NXP, Kaohsiung
• WLCSP process training, 01/2015, Assembly, NXP, Kaohsiung
• Advanced training on 'Board Level Reliability tests', 11/2013, Reliability, NXP, Netherlands
• OHSAS18001 & ISO14001 auditor training, 05/2013, Quality, Kind, Kaohsiung