Summary
Overview
Work History
Education
Skills
Interests
Timeline
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YU-HSIANG CHIU

YU-HSIANG CHIU

Electroplating Process Engineer
Kaohsiung City

Summary

Experienced in DRAM electroplating process. Abundant experience in cost reduction, capacity enhancement and yield improvement. Seeking to leverage my expertise to drive innovation in electroplating process.

Overview

2
2
years of professional experience
2
2
Languages
6
6
years of post-secondary education

Work History

Electroplating Process Engineer

Micron Technology, Inc.
03.2022 - Current
  • Familiar with LAM and AMAT electroplating tool and recipe characteristic. Expert in fine tune suitable process condition for different critical dimension.
  • By evaluating a new process window, I have reduced the copper plating process time by 17% and improve the tool's maximum output by 15%.
  • Collaborating with electroplating equipment engineers, we established a best-in-class record for Machine Availability in electroplating, which has significantly raised the production output to a new level.
  • Collaborating with cross-fab members and vendors, we have cleared all the bins with poor metal-to-via contacts and enhanced backend performance.
  • Introducing new chemical and 2nd source to process, I have saved 838k USD pre year in electroplating module.

Education

Master of Science - Chemistry

National Taiwan University
Taipei, Taiwan
07.2019 - 11.2021

Bachelor of Science - Chemistry

National Taiwan Normal University
Taipei, Taiwan
09.2015 - 06.2019

Skills

Yield Improvement

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Interests

Baseball

Basketball

Music

Timeline

Electroplating Process Engineer

Micron Technology, Inc.
03.2022 - Current

Master of Science - Chemistry

National Taiwan University
07.2019 - 11.2021

Bachelor of Science - Chemistry

National Taiwan Normal University
09.2015 - 06.2019
YU-HSIANG CHIUElectroplating Process Engineer