YU HUSAN KAO
Senior Package Integration Engineer
Overview
7
7
years of professional experience
6
6
years of post-secondary education
2
2
Languages
Work History
Senior Package Integration Engineer
Micron Memory Technology (Taiwan Micron - Taichung)
Taichung
01.2020 - Current
Job Function
- DFMEA account in Micron advance package team
- EFA/PFA Analysis in Assembly/BEOL/Device Level
- Wafer Probe/Back end test software bin/hardware bin analysis
- WAT (In-line/Final Param) data analysis
- Electrical Yield Analysis / In-line Data Analysis
- Process Enhancement by DOE (Screen DOE, Factorial experiment)
- Package reliability
Senior Customer Engineering Integration (NPI)
ASE ChungLi
Taoyuan
10.2015 - 01.2020
- NPI account for international semiconductor customer.
(Qualcomm, Ambarella, Synaptics, Sitime, Analog Device, Onsemi...etc.) - Support customer to develop NPI project from design (Substrate/lead frame/bond diagram) to mass production.
Education
Master - Chemical Engineering
National Taiwan University
Taiwan Taipei 09.2013 - 09.2015
Bachelor - Chemical Engineering
National Taiwan University
Taiwan Taipei 09.2009 - 09.2013
Skills
PFMEA/DFMEA of advance/traditional assembly package
3D Packaging (TSV) Process / Post Wafer Finishing Process (Bumping) know how
EFA/PFA Analysis in Assembly/BEOL/Device Level
Wafer Probe/Back end test software bin/hardware bin analysis
WAT (In-line/Final Param) data analysis
Layout review and pulling skill (K2 viewer/Cadence Virtuoso)
8D/KT Problem Solving
JMP, Linux/Unix, Git/Gitbucket
Backend Electrical Yield Analysis / In-line Data Analysis
Process Enhancement by DOE (Screen DOE, Factorial experiment)
Package reliability
Wire bond / Flip Chip / SiP assembly packaging process (L/F base and Substrate base)
APQP/NPI procedure complied with VDA63/IATF16949
Automotive package
6 Sigma Green Belt (Understanding to CpK/DMAIC flow and procedure)
Overseas Residing supporting experience at Sunnyvale (California Silicon Valley)
Substrate/Lead frame design and manufacturing flow
Demonstrated respect, friendliness and willingness to help wherever needed
Excellent communication skills, both verbal and written
Skilled at working independently and collaboratively in a team environment
Accomplishments
- Help customer to pass Apple audit to get project successfully qualified.
- Help on develop several Automotive NPI product, successfully qualification pass and mass production.
- Improve and drive Micron HBM2e yield from 50% to over 95% in assembly yield wise.
- Resolve several line down issue in HBM3 development, help team up and work on root cause clarification to problem resolution.
Timeline
Senior Package Integration Engineer
Micron Memory Technology (Taiwan Micron - Taichung)
01.2020 - Current
Senior Customer Engineering Integration (NPI)
ASE ChungLi
10.2015 - 01.2020
Master - Chemical Engineering
National Taiwan University
09.2013 - 09.2015
Bachelor - Chemical Engineering
National Taiwan University
09.2009 - 09.2013