Microsoft
YUN-TING HSU
Taichung City,TXG
Summary
Detail-oriented, organized and meticulous employee. Works at fast pace to meet tight deadlines. Enthusiastic team player ready to contribute to company success.
Overview
9
9
years of professional experience
4
4
years of post-secondary education
2
2
Certifications
Work History
Senior Sales Engineer
Daxin Materials
03.2024 - Current
- Investigated competitor technical specifications, product data and industry standards and continually developed knowledge of product offerings.
- Proposed technical solutions and developed prototypes that addressed customer requirements and generated sales.
- Built relationships through exceptional client service delivery and maintained productive networks to support business development.
Package Characterization Engineer
Micron Technology
2 2019 - 1 2024
- Managing materials of passive components, load switch and LDO, and solder pastes for eMMC, MCP,UFS, and BGA SSD devices.
- Managing materials suppliers and ensuring product roadmaps between suppliers and product design development are aligned.
- Maintain smooth communication with suppliers and package design teams, product managers, PIE (Process Integration Engineering), and assembly teams to ensure new product development is on track.
- Improved tombstoning rate DPMO (defects per million opportunities) from1875 to zero by optimizing MLCC termination and reflow profiles.
- Improved process margin SMT process and improved heterogeneous interface delamination from failure rate of 80% to near 0%.
CVD Process Engineer
TSMC
12.2018 - 02.2019
- Analyzed critical line data to make recommendations for improvement.
- Reviewed processes, identifying areas requiring improvement.
Summer Intern
NXP Semiconductors
07.2015 - 08.2015
- Optimized parameters for auto-grinding machine to optimize quality of observation using cross-section analysis.
- Characterized quality problems in packaging process using surface analysis techniques.
Education
Master of Science - Materials Engineering
National Chiao Tung University
Hsinchu County, Taiwan 09.2016 - 10.2018
Bachelor of Science - Materials And Optoelectronic Science
National Sun Yat-Sen University
Kaohsiung City, Taiwan 05.2016 - 10.2018
Skills
Customer Relationship Building
Websites
Accomplishments
Micron Inventor, Jun 2023
https://credentials.micron.com/d2428c33-44c1-41e7-b41f-fbbc219baf6a
Publications
- Co-author of journal paper "Effect of thermal stress on anisotropic grain growth in nano-twinned and untwinned copper films" (Acta Materialia, Jan 2021)
- Author of "Thermal stress relaxation in electroplated nano-twinned copper films", Advanced Metallization Conference, Asian Session (ADMETA 2018), Beijing, China, Oct 2018. (Poster award)
- China patent on “Novel Pad Design as Countermeasures of MLCC Tombstoning”, published in 2022.(CN216313497)
- US patent on “Surface-Mount Device Wire Bonding in Semiconductor Device Assemblies”, filed in2022. (Application #:17/976,625)
- US patent on “Semiconductor Device Assembly Substrates with Tunneled Interconnects, and Methods for Making the Same”, filed in 2022. (Application #: 17/893,968)
- Published conference paper on "Investigation of Bi and In Elemental Additionin Solder Paste for DRAM Module Reliability Enhancement" in ICEP 2023, Kumamoto, Japan.
- Published conference paper on "Tombstoning Investigation of Ultra-small ChipPassive Components on eMMC Products" in IPFA 2023, Penang, Malaysia.
Software
MySQL
Python
Languages
Chinese (Mandarin)
Native language
English
Advanced
C1
Certification
Google Data Analytics Specialization
Timeline
Senior Sales Engineer
Daxin Materials
03.2024 - Current
ASQ CRE Yellow Belt Training
06-2022
Google Data Analytics Specialization
07-2021
CVD Process Engineer
TSMC
12.2018 - 02.2019
Master of Science - Materials Engineering
National Chiao Tung University
09.2016 - 10.2018
Bachelor of Science - Materials And Optoelectronic Science
National Sun Yat-Sen University
05.2016 - 10.2018
Summer Intern
NXP Semiconductors
07.2015 - 08.2015
Package Characterization Engineer
Micron Technology
2 2019 - 1 2024
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