

In October 2022, I joined the Advance Package Business Group at the invitation of James Yang, General Manager of Innolux Corporation. Currently, I am responsible for developing TGV glass core technology and act as the technical liaison directly communicating with Taiwan’s largest semiconductor company due to project demands. Previously, I contributed to the company’s successful transformation, with mass production officially announced at the Q3 2025 earnings conference. I currently lead a team of seven members.
Summary:
- Earned a Ph.D. in Photonics from National Cheng Kung University in 2017- Published six SCI journal articles
- Developed new TGV glass core technology by introducing panel CMP processes and successfully passing customer RA testing with prototypes
- Created new FOPLP technology by implementing a 700mm panel grinder, supporting mass production and shipment for Spc_X- Served as the technical contact for FOPLP, handling direct technical development discussions and product planning with international customers
- Developed new SiP technology by introducing low-temperature sputtering and burr-free processes to enhance EMI shielding manufacturing, applied in products for BRCM, QCM, Apple, and Tesla
- Won the global technology competition within ASE CRD and earned group technical expert certification during my tenure
- Published five patents and 26 trade secrets in semiconductor packaging
- Experienced in managing teams of over 20 members
- Frequently invited to deliver lectures at university departments and campuses
SiP: Back-end process innovation