Zoe Liu
Hsinchu,HSQ
Summary
Application-focused engineer with 5+ years of experience in semiconductor packaging, die attach process engineering, and customer quality management. Strong technical foundation in material behavior, process optimization, data-driven problem solving, and cross-functional coordination. Skilled in presenting technical findings to customers, supporting failure analysis interpretation, and applying structured quality methodologies such as 8D, FMEA, and SPC. Experienced in automotive quality expectations and IATF 16949 audit preparation, with strong communication skills in English and Mandarin.
Overview
6
6
years of professional experience
3
3
Certifications
2
2
Languages
Work History
Customer Quality Engineer
Texas Instruments
09.2023 - Current
- Serve as the primary customer-facing quality representative for major automotive clients, managing complaint investigation, technical communication, and corrective action validation.
- Lead cross-functional 8D problem-solving teams by coordinating Process, FA, and Manufacturing Engineering groups to drive robust root cause identification and corrective/preventive actions.
- Collaborate with FA engineers to interpret electrical, mechanical, and material-related failure mechanisms for customer returns and qualification activities.
- Prepare and deliver structured technical reports and presentations in both English and Mandarin for global customers.
- Support IATF 16949 external audits and automotive customer audits, ensuring compliance, documentation readiness, and improvement tracking.
- Manage wafer IQC activities including material disposition, supplier coordination, and incoming quality monitoring to strengthen upstream control.
- Enhance quality system robustness through improved traceability, defect trend analysis, SPC monitoring, and risk mitigation.
Process Engineer – Die Attach
Texas Instruments
09.2019 - 08.2023
- Owned the semiconductor die attach process module, overseeing bonding materials, process parameters, equipment stability, and continuous improvement activities.
- Performed DOE studies to optimize material behavior, reduce variation, and enhance process throughput and yield.
- Developed automated scripts for high-volume production parameter extraction and analysis, enabling data-driven process optimization.
- Partnered with IT and equipment vendors to implement a real-time machine parameter monitoring and control system, improving process stability and reducing operator intervention.
- Designed and executed experiments to identify process improvements, leading to reduced costs and increased efficiency.
Education
Master of Science - Power Mechanical Engineering
National Tsing Hua University
Hsinchu 04.2001 -
Bachelor of Science - Mechanical Engineering
National Yunlin University of Science And Technology
04.2001 -
Skills
- Process Tools: DOE, SPC, Data Automation
Certification
- IATF 16949 Core Tools Workshop
CORE COMPETENCIES
- - Die Attach Process Engineering & Packaging Materials
- - Customer Quality Engineering (Automotive Focus)
- - Material Characterization & Failure Analysis Collaboration
- - DOE, SPC, Root Cause Analysis, 8D
- - Data Automation & High-volume Parameter Analysis
- - Technical Reporting & Customer Communication
- - Process Optimization & Efficiency Improvement
- - IATF 16949 Audit Support
Timeline
Customer Quality Engineer
Texas Instruments
09.2023 - Current
Process Engineer – Die Attach
Texas Instruments
09.2019 - 08.2023
Master of Science - Power Mechanical Engineering
National Tsing Hua University
04.2001 -
Bachelor of Science - Mechanical Engineering
National Yunlin University of Science And Technology
04.2001 -