CHAO CHIN Huang

• Conducted root cause analysis using advanced techniques, resulting in higher success rates in identifying issues.
• Maintained high-quality standards through regular audits of laboratory equipment and adherence to industry regulations.
• Assisted design engineers in improving product performance through detailed feedback on failure trends and specific recommendations.
• Provided training to junior engineers on best practices in failure analysis techniques, promoting a knowledgeable workforce.
• Actively participated in global conferences showcasing advancements in failure analysis technology, staying informed about industry trends.
• Participated in continuous improvement initiatives aimed at reducing cycle time and increasing overall productivity.
• Collaborated with cross-functional teams to identify and resolve complex failure mechanisms in semiconductor devices.
• Developed new testing procedures that improved the accuracy of fault isolation, expediting problem-solving efforts.

• Enhanced production yield by developing and implementing effective corrective actions for process improvements.
• Enhanced collaboration between departments by serving as the primary point of contact for all failure analysis-related concerns.
• Increased customer satisfaction levels by consistently delivering comprehensive reports detailing findings and actionable solutions.
• Reduced customer complaints by providing prompt technical support and thorough failure analysis reports.
• Enhanced overall business analysis by streamlining data collection methods and implementing advanced analytics tools.
• Analyzed data sets to identify trends, yielding insights for efficiency and cost reduction.

Achievements:
• Secure lab build up in order to perform failure analysis for secure products
• Product Analysis Tracking Sys introduction from LS FSL after marge.
• Define intake check list to guarantee success rate and TPT.

• Implemented lean manufacturing methodologies within the failure analysis laboratory to optimize operational efficiency.
• Enhanced methodologies for accurate identification of device malfunctions, resulting in reduced resolution times.
• Improved product reliability by conducting comprehensive failure analysis investigations and identifying root causes.
• Provided training to junior engineers on best practices in failure analysis techniques, promoting a knowledgeable workforce.
• Resolved customer complaints with empathy, resulting in increased loyalty and repeat business.
• Managed high-stress situations effectively, maintaining professionalism under pressure while resolving disputes or conflicts.

Achievements:
• Lead a cross lab team to build FA method and flow creation for WLCSP. Helped the company win important orders from mobile phone customers.
• Socket and TLB creation to support bare die failure analysis.

• Collaborated with process and equipment and test engineering team on unstable testing issue.
• Collaborated with cross-functional teams to ensure seamless integration of product components.

• Tested completed projects for functionality and implemented changes to production methods to rectify issues in final products.
• Led continuous improvements in engineering, resulting in clearer product design standards, better manufacturability and reduced engineering cycle time.

Achievements:

• Building an automated wafer test model with O+ and load out at wafer testing production line total 46 EG prober include monitor in time, auto cleaning and watch dog for TTR.
• Build defect detection by using bit mapping data for SSMC CMOS140 yield enhancement.

• Enhanced product quality through meticulous monitoring of production processes and data analysis.
• Served as a key liaison between engineering, maintenance, and production teams to ensure seamless communication and collaboration on critical projects.
• Led cross-functional teams to identify areas for potential cost savings and process improvements, resulting in increased profitability.
• Contributed significantly to successful new product launches by collaborating with R&D teams on scalable manufacturing strategies from concept to commercialization stages.
• Optimized process efficiency by identifying bottlenecks and implementing targeted improvements.

Achievement:
• Define hold lot disposition flow and methods with process integration and product engineer.
• Hold lot team build up in Nijmegen to taken on hold lot disposition. Total 4 technicians in this team.
• Statistical analysis by using memory and logic mapping data.

Product Engineer (PE) at Philips Semiconductors KHH Wafer Test Factory (WTF). His main business is wafer testing quality control and wafer yield improvement. Mainly responsible for products from TSMC C150 (300nm),100(200nm),180(C180) and 130(C130).
• Collaborated with cross-functional teams (wafer fab, testing center and designer...) on yield enhancement
• Led continuous improvements in engineering, resulting in clearer product design standards, better manufacturability and reduced engineering cycle time.

• Join prototype development efforts, refining designs based on user feedback and testing data.
• Implemented cost-saving measures throughout the production process without compromising on performance or quality.
• Streamlined the production process for increased efficiency and reduced manufacturing times.

Achievement:
2003 : Successfully released C180 process with the team (Philip, TSMC and VIS) which a milestone for VIS from DRAM factory to IC foundry.
2004 : Work with TSMC Team and Philips design to found failure mode and root cause of SRAM which is Phillips Self-Align wafer technology related. The yield saving around 8~10% for 6" wafer and 5% for 8" wafers.
2005 : Hold lots disposition process and flow improvement . Average 12 hours hold time reduction and free up 20% ~30% engineer resource.